Scrubber Systems—Ultra C s

For front and backside wet-cleaning applications

ACM Research’s Ultra C s scrubber tool expands the company’s scrubber capabilities, proven for wafer-level packaging (WLP), to IC foundry processing. With its advanced dual-fluid spray-cleaning technique using gentle nitrogen gas (N2) spray, backside brush and bevel brush, using a precise pressure control system, the tool provides high-efficiency particle removal and scratch-free cleaning of the wafer frontside, backside and bevel. It can also be optionally equipped with ACM’s patented SAPS™ megasonic technology for more intense cleaning and removal of smaller particles.

The system’s modular design allows the Ultra C s to be configured with eight chambers for 300mm IC applications—four each for frontside and backside cleaning. With its flexibility, small footprint and high throughput, the Ultra C s offers a cost-effective scrubber solution.

Features & Specifications

  • Flexible cleaning method combination
    • Dual-fluid spray-cleaning
    • Backside brush clean
    • Bevel brush clean
    • Optionally equipped with SAPS™ advanced cleaning
  • Double-sided sequential cleaning capability with wafer-flipping function
  • Flexible configuration
    • For IC manufacturing – eight chambers, 300mm wafer compatibility
    • For WLP – four chambers, 200m and 300mm wafer compatibility

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