ACM Research

Advanced Production Tools for Leading Edge IC Fabs

Our multi-product portfolio of tools support IC and compound semi manufacturing, wafer-level packaging, and wafer manufacturing

Our product offering supports a wide range of process steps, including single-wafer and batch wet cleaning, electroplating, thermal deposition, stress-free polishing, PECVD, and track. We deliver customized, high-performance, cost-effective tools, processes, and support solutions that improve productivity and yield for high volume manufacturers.

Our track record of collaboration with our customer base allows us to meet a wide range of process requirements on a variety of wafer sizes. Backed by our IP portfolio of more than 448 internationally granted patents, we are committed to providing customers with innovative technology, world-class products and strong service and support around the globe.

ACM Research, Inc. was founded in California in 1998 to supply capital equipment to the global semiconductor industry. We conduct the majority of product development, manufacturing, support and services through our subsidiary ACM Research (Shanghai), formed by ACM Research in the People’s Republic of China 2005. We perform additional product development and subsystem production in Incheon, South Korea, and we provide sales, marketing and advanced services coverage in North America, Europe and certain regions in Asia outside mainland China.

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Looking for customized solutions for your wet wafer processing, ECP, Furnace, Track and SFP?

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