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ACM Developer Systems

For Wafer Level Packaging

Three photoresist development tools in one

The ACM Developer system performs crucial steps in the wafer level packaging (WLP) manufacturing process. This tool is compatible with 300mm and 200mm wafer processes and is capable of the following steps in the lithography process:

  • Post Exposure Baking (PEB)
  • Developing
  • Hard Bake

With superior technology this developer is designed to provide the precise flow rate and temperature control needed for quality photoresist development processes. A highly flexible tool, the ACM Developer provides more options and allows users to establish the best balance between throughput time and chemical cost usage through a choice of three different development methods.

Major Benefits

Three Development Methods in One Tool
The ACM Development tool is capable of performing three different methods of wafer photoresist development: Spray, Puddle, and Wet Spin. It is very easy to switch between methods, and the tool can also be configured to perform a combination of all three.

Flexible Nozzle Scan System
The Nozzle Scan system is designed to give users flexibility and control of their processing. With programmable speed and movement rage, the nozzle can be adjusted to suit the specific wafer thickness and process requirements.

Superior Technology, Ease of Use
This system incorporates advanced component modules such as high-precision wafer transfer systems, superior fan filter & exhaust units, and independent control of the process environment for each chamber. All these modules are designed for ease of use while delivering the desired developer thickness and uniformity. Customizable software also allows the tool to easily integrate into the production line.

Precise Control
ACM tools contain state-of-the-art chemical temperature and flow rate control systems. This ensures that chemicals are released in exactly the correct amounts and temperatures throughout the manufacturing process. The ACM Developer is able to provide a controlled flow rate that is +/- 0.3 LPM of the desired flow rate and +/- 0.5 Celsius of the desired temperature.

Protecting the Environment, Reducing Costs
Because the company is committed to protecting the world’s environment, all ACM systems are fitted with chemical recycle and filter systems that serve to reuse chemicals, decrease waste — and reduce the user’s costs.

Features & Specifications

  • 8” and 12” wafer compatible
  • Process Module includes
    • 1 to 4 sets of developing chambers with:
      • ULPA FFU in each developing chamber
      • 1 to 5 sets liquid nozzles  in each developing chamber
      • N2 nozzle for wafer dry
      • 1 to 3 backside cleaning nozzles
    • 2 to 8 baking plates
    • 2 to 6 cooling plate
  • Chemical and Plumbing  Module includes:
    • 1 to 5 sets of chemical delivery units for wafer developing and cleaning usage
  • Wafer transfer Module includes:
    • 1 to 4 load port
    • Optical wafer centering aligner
    • Robot with 2 to 4 vacuum or mechanical arms
    • ULPA FFU in robot bay