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ACM Research in the News

ACM TEBO Damage-free Cleaning Technology Enters
HLMC Mass Production Line

July 2017
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ACM Demonstrates Damage-free Cleaning Technology on 1X nm Patterned Wafers

March 2016
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ACM Receives Orders for Four SAPS Megasonic Single-Wafer Cleaning Systems

April 2013
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ACM Releases Stress Free Polishing Integration Equipment

October 2011
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ACM Proprietary Technology Removes 1X nm Level Particles on 12” Wafers with Minimum Material Loss and Without Damage

March 2011
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