Slider

ACM Research

Dedicated to advanced semiconductor wet processing

Focused on innovative wafer cleaning

Founded in 1998 in Silicon Valley, ACM Research, Inc. develops wet processing technology and products for the semiconductor industry. The company has produced equipment for a range of applications in IC manufacturing and wafer level packaging — with a special focus on cleaning technologies for advanced semiconductor devices.

In September 2006, ACM expanded its operations into Asia and formed the subsidiary, ACM Research (Shanghai), Inc. ACM now has complete R&D, engineering and manufacturing operations at its Zhangjiang High-Tech Park facility in Shanghai, China. In June 2011, the company formed a second subsidiary, ACM Research (Wuxi), Inc., to better serve to customers in that region. In addition, advanced service coverage has also been positioned at strategic locations around the globe, including Beijing, Taiwan, Korea, and the U.S., to provide world-class support for customers worldwide.

ACM Research provides advanced wafer cleaning and wet processing equipment for semiconductor manufacturingThe company’s initial focus was on ultra-low-K dielectric and copper integration, particularly on stress-free copper polishing technology, with the first product being introduced in 2001 and sold to leading edge wafer manufacturers in the U.S. In 2003 the company began to design innovative new single-wafer cleaning equipment aimed at the emerging generations of IC chips that presented increasing challenges for defect reduction. ACM Research has established important intellectual property (IP) in its proprietary Space Alternated Phase Shift (SAPS™) and Timely Energized Bubble Oscillation (TEBO™) megasonic cleaning technologies, along with their special chamber and platform designs. The TEBO technology in particular has been groundbreaking and revolutionary in enabling future generations of semiconductor circuits.

In October 2008, ACM Research Shanghai won an R&D grant to develop and commercialize the 65-45nm stress-free Cu polishing technology (SFP™). In January 2014 the company won another R&D grant to develop ACM’s new electro-copper plating (ECP™) technology. Presently holding a strong IP portfolio of over 140 internationally granted patents, ACM is committed to providing customers with leading-edge technology, world-class products and unexcelled service and support.